THERMAL ENGINEERING 2009

The 11th Thermal Engineering Exhibition

This exhibition is the one and only specialized exhibition in Japan on heat management. Applications of the latest technologies are presented, ranging from heat management products & systems, parts & materials, to software. Visitors are design & development engineers interested in heat problems such as dysfunction, shortening of longevity, and deformation. This event accelerates your business and technology information interchange.

Exhibits

Heat Management Products and Systems

  • Heat Control Equipment
  • Cooler System
  • Radiator
  • Limit Heat Control System
  • Temperature Controller
  • Thermal Sensor(Thermistor, Thermoelectric Couple, Thermal Sensitive Ferrite, Bimetal, IC, Thermal Sensor, Pyrometer, Bicolor Thermometer, Radiation Thermopile,  Bolometer, Pyroelectric Meter, Infrared-rays Element)
  • Thermography (Infrared Thermometer)
  • Power Supply Regulator
  • Humidity Controller, etc.

Heat Management Parts

  • Heat Sink
  • Heat Dissipation Fin
  • Heat Pipe
  • Heat Transportation Devices
  • Heat Spreader
  • Peltier Element
  • Peltier Module, Thermal Module
  • CPU Cooler
  • Fan Motor
  • Micro Cooler
  • Micro pump
  • Thermal Fuse, etc.

Heat Management Material

  • High Temperature Conductivity Aluminum Substrate/Metal Substrate
  • Heat Dissipation Sheet
  • High Heat Conductivity Adhesive
  • Silicone Rubber
  • Insulating Material
  • Heat Dissipation Printed Wiring Board
  • Refrigerant Alloy/Compound (PPS, PPE)
  • Heat Dissipation Materials
  • Coating Materials

Heat Management Software

  • Heat Conduction Analysis Software
  • Heat Flow Analysis Software, etc.

Other Heat Management Products

Visitor Profile

  • Development & Design Engineers or Specialists related to the category as followings
    • Automobile/Transportation Equipment
    • Electronics Equipment
    • Office Application/Office Equipment
    • Precision Mechanical Equipment
    • Semiconductor
    • Semiconductor Manufacturing Equipment
    • Computer
    • Computer Peripheral Equipment
    • Machine Tool
    • Factory Automation Equipment
    • Robot
    • Medical Equipment
    • Amusement Machine
    • Logistics/Conveyance Equipment
    • Communication Equipment
    • Measuring Equipment
    • Control Equipment
    • Construction Machinery
    • Aircraft/Spacecraft Equipment, etc.

Exhibition Profile

Exhibition Name THERMAL ENGINEERING 2009
Date April 15(Wed) - 17(Fri) 2009 (3days)
Venue Makuhari Messe
Organizer Japan Management Association
Exhibition Scale(planned) 85 companies / 170 booths
Number of Visitors (expected) 14,000